There are two distinct types of laser inspection systems. The first uses a scanning laser as the light source for a camera-based inspection system. The inspection is based solely on the visual appearance of the joint. 共有2种截然不同的激光检测方法。第一种是基于将扫描激光作为光源的照相检测方法。该方法仅仅检测组织的视觉外观。The second laser technique, known as the Vanzetti system, uses a laser to heat each solder joint individually, then uses an IR detector to monitor how rapidly the joint loses heat. 第二种方法,也叫vanzetti法,利用激光独立的给各个焊接组织加热,然后用IR检测器监测组织的散热速度。The heat loss rate is an indication of both proper solder volume and proper connection to the substrate. 散热速度是既可以显示焊接替的大小,有可以显示与基底的密合情况。This system will detect voids as well as solder insufficients, since the volume of a joint with large voids in it will inhibit heat transfer from the joint to the board. 该方法可以检测到空隙和焊接不密合处,因为带有巨大空隙的组织会阻止热量传递到基板。Relatively low in speed and high in cost, laser-based camera systems can be used for post-deposition solder-paste volume measurements, as well as post-reflow solder joint inspections.相对来说有点慢费用高,激光照相法可用来作为沉积物和焊接体积检测,也可以用来焊点回流检测。 Like visual inspectors, laser systems must have direct visual access to the joints they are to inspect就像图像检测器一样,激光必定可以引导进入待检测的组织。