光刻胶英语

一般代号ETH= etch,EOP = etch on process.

光刻胶（英语：photoresist），亦称为光阻或光阻剂，是指通过紫外光、深紫外光、电子束、离子束、X射线等光照或辐射，其溶解度发生变化的耐蚀刻薄膜材料，是光刻工艺中的关键材料，主要应用于集成电路和半导体分立器件的细微图形加工。

Alone with a specific frequency (wavelength) of electromagnetic radiation, with energy. Use of the energy of light, the induction has the chemical activity of liquid chemicals (light initiator, resin, monomer) by rapid polymerization crosslinking, instantaneous process called light curing technology of solid materials. Compared with thermal curing methods, light curing with curing speed, no heating, use fewer solvents, high efficiency and energy saving, the advantages of curing process can be automated, curing light is known as the green technology of the 21st century. Light curing material has been widely used in every aspect of our daily life, such as paint, printing ink, printing, optical lenses, microelectronics devices, CD, optical fiber, and other fields, and formed the application of the $12 billion global market.Lithography technology and use the energy of the light, light control through the area that has the chemical activity of liquid chemicals fast photochemical reaction, and through the graphic technology to achieve selective corrosion. In order to realize the selective corrosion, you need to use the solubility, melting or affinity of obvious changes in material after exposure. This kind of material called a photoresist. Photoresist has the photochemical sensitivity, can use the photochemical reaction, the exposure and development process, such as fine graphics from mask template will need to be processed on the substrate, and then to etching process, etc. Photoresist is the most important materials, micro manufacturing was invented in 1959, has become the core of the process in the semiconductor industry. Photoresist inUv curing materials, although photoresist is made by light initiator or photosensitizer, resin, the monomer (or reactive diluent) is composed of three main chemical raw material and other additives, but resist the need to use special chemicals raw materials. Photoresist is imaging materials, and light curing materials compared to different purposes, the exposure light source and light energy use is different, the reaction mechanism is not exactly the same, for material solubility, etching, photosensitive resistance, heat resistance and so on different requirements, all kinds of photoresist used light initiator, raw materials such as resin, the monomer need different chemical structure and properties of specialty chemicals. And photoresist for processing production lines, very elaborate graphics for the purity of raw materials, impurities, such as metal ions content has a very high ?Light initiator is a kind of can absorb light energy (radiant energy), the excitation generated active intermediates, chemical change and further polymerization material, is a key component of photoresist, sensitivity of photoresist is crucial, resolution, etc. Light initiator for the active intermediates, can be classified as free radical initiator and cationic light initiator. Photoresist type used in free radical initiator is more light, for light initiator of exposure light wavelength absorption rate is high, and the compatibility of photoresist resin is good, or good matching and pigments, dyes, etc. Light sensitizer is additive, it is to point to absorb light energy transferring energy to a light initiator or itself do not absorb light energy but improve the efficiency of trigger ? complicit in photochemical reactionAcid production is similar to the cationic light initiator, but cationic part does not contain metal, phosphorus and other elements, molecules after absorbing sunlight photolysis reactions, produce strong acid reaction substances, used for chemical growth at the top of the photoresist. Resin is the largest percentage of photoresist composition, constitute the basic skeleton of photoresist, mainly decide the basic properties of the photoresist after exposure, including hardness, flexibility, adhesion, exposure before and after exposure to specific solvent solubility produce change, optical properties, aging resistance and etching resistance, thermal stability, etc.好了，看我这么辛苦，，，望采纳啊！

Light is a specific frequency (wavelength) of electromagnetic radiation, with energy. Using light energy, chemical liquid induced with chemical activity (photoinitiator, resin, monomer) by rapid polymerization crosslinking, the instant realization process of solid state materials called light curing technology. Compared with the thermal curing method, UV curing speed, without heating, using less solvent, high efficiency and energy saving, the curing process advantages of automatic operation, light cured called green technology in twenty-first Century. Light cured materials have been widely used in every aspect of our daily lives, such as paint, ink, printing, optical lens, microelectronic devices, optical disk, optical fiber and other fields, and the formation of a $12000000000 global market. Lithography is the use of light energy, by controlling the illumination area make chemical liquid with chemical activity fast photochemical reaction occurs, and graphics technology through the implementation of selective corrosion. In order to realize the selective corrosion, require the use of solubility, melting or dear compliance after exposure change materials. This kind of material called photoresist. Photoresist with chemical sensitivity, which can be used for photochemical reactions, exposure, developing process, will need fine pattern from the substrate to be processed mask, and etching process. Photoresist is the most important material for micro manufacturing field, since the invention in 1959, will become the core technology of material of semiconductor industry. Patterned photoresist processing line in the subsequent development are widely used in optoelectronic information industry production, is the key material of microfabrication technology. Light cured materials, photoresist although is light initiator (or photosensitizers), resin, monomer (or reactive diluent) is composed of three species of main chemical raw material and other additives, but the photoresist requires the use of special chemical materials. Photoresist is imaging materials, compared, and light curing materials for different purposes, the exposure light source and light energy use are different, the reaction mechanism is not completely the same, the solubility, corrosion resistant material etching, the photographic properties, heat resistance and other requirements are different, all kinds of photoresist using light initiated special chemical agent, resin, monomer raw materials require different chemical structure, the performance of different. But the photoresist for processing graphic lines are very fine, have very high requirements on the purity of raw materials, impurities, metal ion content. Many photoresist species, according to the chemical reaction mechanism and developing principle, can be divided into negative and positive glue two glue. The chemical structure of photoresist based, can be divided into three types: light polymerization type, light type, light crosslinking type decomposition. The photoresist after decades of continuous development and progress, application domain expands unceasingly, derived from a wide variety of different types, precision of the exposure light source, reaction mechanism, manufacturing process, film properties, processing graphics line photoresist different uses of different properties, the performance requirements of raw materials are not the same. Therefore, each kind of photoresist materials used in chemical structure, properties are more special, special chemicals required different levels of quality. Photo initiator is able to absorb light energy (radiation), the induced generation of reactive intermediates chemical changes, and further polymerization material, is a key group of photoresist, photoresist sensitivity, resolution plays a decisive role. Photoinitiator for reactive intermediates produced by different, can be divided into radical photoinitiator and cationic photoinitiators. Free radical type used in the photoetching glue photoinitiator is more, light induced absorption agent on the requirements of the exposure light source wavelength rate is high, and the photoresist resin has good compatibility and pigments, dyes, or a good matching etc.. The photo sensitizer is the cause of AIDS, which can absorb the light energy is the energy transferred to the light initiator or itself does not absorb light energy but the synergy of photochemical reactions in improving efficiency of initiation material. Because of the change of the exposure light source, photoresist need more light sensitizing agent formula. Light acid producing agent is similar to the cationic photoinitiator, but cationic metal free, phosphorus and other elements, the photolysis in absorb the light energy and molecular, produce acid reaction substance, for chemically amplified photoresist cutting-edge. Resin is the largest proportion of photoresist composition, form the basic frame of photoresist, mainly determines the basic performance after exposure of photoresist, including hardness, flexibility, adhesion, exposure before and after exposure to a specific solvent solubility changes, optical properties, aging resistance, corrosion resistance, thermal stability.

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